MCDMR06T Farnell HEAT SINK, 40X40X5MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.38C/W; EXTERNAL WIDTH:40MM; HEIGHT:5MM; HEATSINK MATERIAL:ALUMINIUM; E
Part Nnumber
MCDMR06T
Description
HEAT SINK, 40X40X5MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.38C/W; EXTERNAL WIDTH:40MM; HEIGHT:5MM; HEATSINK MATERIAL:ALUMINIUM; E
Producer
Farnell
Basic price
15,48 EUR
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